Intel Corporation (NASDAQ:INTC) inches up in pre trading session on Thursday as in last trading session shares surged over 2.87% to settle at $29.07 with 63.3 million volume of shares traded. The company and the University of California, San Diego (UC San Diego) said that they have been chosen to join the team working on the Defense Advanced Research Projects Agency’s Hardening Development Toolchains Against Emergent Execution Engines (HARDEN) initiative (DARPA). In response to decades of platform hardening efforts and expanding IT security measures that minimize vulnerabilities, adversaries have developed increasingly complicated assaults. The risks of intrusion into current and historical code have grown as attempts to minimize these dangers have failed.
There are more opportunities for exploit execution due to the increasing complexity of computer systems. We will continue our study with UC San Diego as part of the DARPA HARDEN initiative to develop a workable strategy for protecting legacy and upcoming systems against assaults throughout the federal computing environment and beyond.
Intel cutting pay as sales suffer, cost pressures mount
As it struggles to deal with a significant decline in revenue, Intel Corp. (INTC) is reducing CEO and staff pays. The chipmaker announced the move on Tuesday night, just days after reporting dismal quarterly results. Reductions are said to range from a 25% drop to CEO Pat Gelsinger’s basic compensation to a 5% decrease for midlevel staff. Merit hikes and quarterly bonuses were stopped, and 401(k) plan contributions were also being decreased.
The company said through email that the firm has made a number of changes to its employee compensation and incentives programs for 2023 as it try to navigate macroeconomic headwinds and cut expenses throughout the organization. These modifications are intended to have a larger impact on firm executive population and will support the staff expansion and capital expenditures required to quicken firm transition and realize firm long-term goals. As they aware that these adjustments will not be simple, they appreciate their workers’ dedication to Intel and their patience throughout this transition.
Although no job losses have been publicly announced in Oregon, Intel (INTC) started laying off employees late last year in an effort to reduce costs by $3 billion this year and up to $10 billion by 2025.
Wolfspeed, Inc. (NYSE: WOLF) Joins Hand with ZF for Future Silicon Carbide
A combined innovation lab will be established to enhance Silicon Carbide systems and devices for mobility, industry, and energy applications, according to a strategic alliance announced by Wolfspeed, Inc. (NYSE: WOLF). The cooperation also involves a sizable investment by ZF to enable the development of the largest and most sophisticated 200mm Silicon Carbide device fab in the world in Ensdorf, Germany. The European Commission must approve state assistance before the planned joint innovation lab and Wolfspeed device fab can move forward as planned components of the Important Project of Common European Interest (IPCEI) for Microelectronics and Communication Technologies framework.
“These initiatives are a significant step towards a successful industrial transformation. They strengthen European supply resilience and, at the same time, support the European Green Deal and the strategic goals for Europe’s Digital Decade,” said Dr. Holger Klein, CEO of ZF.
UMC (NYSE: UMC) and Cadence Collaborate on 3D-IC Hybrid
United Microelectronics Corporation (NYSE: UMC; TWSE: 2303) and Cadence Design Systems, Inc. (NASDAQ: CDNS) declared that the IntegrityTM 3D-IC Platform, a component of the Cadence 3D-IC reference flow, has been certified for use with UMC’s chip stacking technologies, enabling a quicker time to market.
The VP of device technology development & design support at UMC, Osbert Cheng stated that in the past year, there has been a noticeable rise in interest in 3D-IC solutions as our clients look for ways to improve design performance without increasing cost or space. The foundations of UMC’s hybrid bonding technologies are cost-effectiveness and design dependability, and this partnership with Cadence gives joint clients both thanks to the advantages of 3D structures while also reducing the time it takes to finish their integrated designs.